Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow. This may be somewhat mythical and what little cracking is still observed usually tends to be due to defects in the manufacturing process of the capacitor. Cracking of plastic-molded packages, such as QFPs and BGAs, sometimes called the popcorn effect is sometimes due to absorbed moisture in the thermoset plastic body but may also be due to a flaw in the design and/or manufacture of the component.
