Home » PCB Dewetting
Re-printed in partnership with ITM

PCB Dewetting

PCB Dewetting is a condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film and the base metal is not exposed.

Process and design-related causes of PCB Dewetting:

  • Solder paste flux not aggressive enough for level of oxidation present on part or PCB
  • PCB pad contaminated
  • Component lead contaminated
  • Excessive moisture absorbed by paste
  • Paste exposed beyond worklife
  • Ambient humidity and temperature beyond paste work envelope
  • A palladium lead finish which requires higher reflow (liquidus) temperature
  • Reflow-related causes:
  • Peak reflow (liquidus) temperature not being attained
  • Malfunctioning oven which is impeding attenuation of proper temperatures
Custom Solution
Please fill out the contact form below with details and our staff will contact about a custom solution.
Home Email Phone Search
×
Heller Industries, Inc.

4 Vreeland Road,

Florham Park, NJ 07932, USA

Contact Us

+1-973-377-6800

help@hellerindustries.com

Global Support

Heller offices span the globe.

Find representative

Spare Parts