…and Die Attach Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which requires separate reflow processes. For…
…to save space, reduce cost and support both reflow and short-term curing for users. Improving curing productivity with a family of in-line vertical ovens for users of die attach, flip…
…strategically concentrates on two key factors to satisfy the Industry 4.0 requirement for Reflow Soldering Equipment: Communication software: Machines have two protocols for semiconductor equipment communication standard/generic equipment model (SEC/GEM)…
…Excellence Award HELLER Service Team received recognition from Pegatron 2021 Semiconductor Review Top Semiconductor Manufacturing Provider 2021 Soldering Equipment Service Excellence Award Company of the Year Award (Soldering Equipment) 2020…
…constantly improving the SMT reflow soldering equipment to handle the demands of Industry 4.0 while reducing the equipment’s nitrogen and power consumption. The company’s equipment currently operates below 10 kilowatts…
520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill…
…knows it can depend on our reliable equipment, continuous innovation, and responsive engineering. Pressure Curing Ovens & Back-end Semiconductor Manufacturing Equipment Pressure Curing Ovens & Back-end Semiconductor Manufacturing customized ovens…
Used Heller Reflow Ovens & Equipment 1707MK3V_A Model:1707MK3V_A Build date:11/22/2014 Oven location:China Book Value:$9,000 Comment:Good Condition Feature Listing:Call for details and info 1707MK5_A Model:1707MK5_A Build date:9/26/2018 Oven location:China Book Value:$10,000…
Technically advanced, high-quality products and unmatched customer focus reinforce company’s market share leadership. Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost &…
Company Of The Year Award (Soldering Equipment) 30th October, 2020 The 2020 Global Surface Mount Technology Soldering Equipment Award – Heller Industries Frost & Sullivan states that “New Jersey-headquartered Heller…