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Void Free Soldering with Vacuum Assisted Reflow

High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards.
Voids in solder joints can lead to many undesirable issues such as

  • Device overheating
  • Reduced electrical performance
  • Reduced RF performance for high-frequency applications
  • Lower overall reliability

Voids can be effectively removed with vacuum assisted reflow.

  • Trapped gas bubbles increase in size as pressure is reduced.
  • Larger bubbles combine with other bubbles and ultimately collide with the edge of liquid solder to escape.
  • Larger bubbles are accelerated by stronger buoyancy forces making them more likely to escape.

Void Free Soldering photo

Normal Reflow

Vacuum Reflow

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