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PCB Dewetting

PCB Dewetting is a condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film and the base metal is not exposed.

Process and design-related causes of PCB Dewetting:

  • Solder paste flux not aggressive enough for level of oxidation present on part or PCB
  • PCB pad contaminated
  • Component lead contaminated
  • Excessive moisture absorbed by paste
  • Paste exposed beyond worklife
  • Ambient humidity and temperature beyond paste work envelope
  • A palladium lead finish which requires higher reflow (liquidus) temperature
  • Reflow-related causes:
  • Peak reflow (liquidus) temperature not being attained
  • Malfunctioning oven which is impeding attenuation of proper temperatures
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Heller Industries, Inc.

4 Vreeland Road,

Florham Park, NJ 07932, USA

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