…Excess Solder Deposition Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls Intermetallics Appearance Component Cracking Bridging Grainy Solder Laminate Discoloration Leaching Halo Effect Discolored…