…solder wicking, and reduced solder voiding. More formic reflow information. Underfill Curing Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller pressure curing…
520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill…
Youtube video/vco-755-in-line-continuous-cure-vertical-format-mini-curing-oven/…
Youtube video/pco-860-pressure-cure-oven/…
…the potential be trapped between interconnects, blocking underfill flow. This results in underfill voids and causes reduced reliability Formic Acid Replaces the Need for Flux Fluxless reflow utilizes Formic Acid…
…the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the highest productivity by eliminating wasted…
…a recipe-defined thermal profile during the entire curing cycle. A typical PCO temperature and Pressure profile. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping…
Heller VCO 755 In-line, Continuous Cure, Vertical Format Mini Curing Oven Increase productivity, improve quality, reduce costs… with vertical format curing solutions from Heller. In-line, vertical automation of the epoxy…
…provide cure cycles as long as four hours. A versatile curing oven with configurations available for various pallet sizes. Oven Size: 755 K3- 1900 (L) x 1620 (W) x 2000…
…chip underfill and COB encapsulation applications. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners to develop flux-free formic reflow and void-free…