Re-printed in partnership with ITM Wicking Defects Defect: wicking A Wicking Defect is the flow of solder either up the lead of the component or along traces and possibly under insulation and through via holes. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in […]
Semiconductor Advanced Packaging Heller Industries offers multiple equipment solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, […]
Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp Excessive Heating Rate Preheat Temp Low Solder Paste Oxidation Screen/Stencil Clogged Insufficient Solder Paste Oxidized Solder Paste Paste Viscosity Too Low Misaligned Component Excess Solder Deposition […]