Solving Flip Chip Die Crack Issues

Executive Summary: 

One of our global OSAT clients faced die crack issues during the flip chip reflow process, threatening production quality. Heller Industries resolved the problem by fine tuning the reflow oven and implementing precise thermal control solutions. The result: defect-free production, a major customer win for the client, and over 300 ovens delivered to one of client’s sites—demonstrating Heller’s leadership in advanced semiconductor packaging solutions.

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