HELLER Makes Appearance at CEIA Qingdao Seminar: Leading with Innovation, Jointly Mapping Out a New Blueprint for Electronic Smart Manufacturing

Qingdao, this sparkling coastal city, has once again become a gathering place for technological innovation. On April 18, 2024, HELLER made a grand appearance at the China Electronic Intelligent Manufacturing Summit Forum (CEIA) Qingdao Seminar. At this prestigious event,
HELLER showcased its cutting-edge technologies and solutions, joining forces with global industry elites to delve into the future direction of electronic smart manufacturing and jointly promoting innovation and progress in the industry.

As a leader in the global reflow soldering field, HELLER has always been committed to providing clients with excellent and efficient solutions. At the CEIA Summit Forum, HELLER exhibited its new achievements in the field of electronic smart manufacturing and engaged in deep discussions with participants on the current state, development trends, and challenges faced by the industry. Drawing from successful cases and practical experiences, HELLER shared the "solution to the vacuum reflow production capacity bottleneck," an innovative product and technology that has significantly boosted production efficiency and achieved remarkable breakthroughs in quality and cost control.

For HELLER, participating in the CEIA Summit Forum was not only an excellent opportunity to showcase its strength but also a gathering to discuss the future with industry peers. HELLER will continue to adhere to the philosophy of innovation and pragmatism, providing global clients with higher-quality and more efficient solutions for electronic smart manufacturing.

As technology rapidly evolves and the market constantly changes, the field of electronic smart manufacturing is experiencing unprecedented development opportunities and challenges.
HELLER will continue to increase research and development investments, collaborating with global partners to jointly promote innovation and development in the industry.

In conclusion, HELLER's outstanding performance at the CEIA Qingdao Seminar fully demonstrates its leading position and strong strength in the field of electronic smart manufacturing. This forum not only provided a platform for HELLER to share the latest technologies and ideas with global industry peers but also strengthened close ties with its partners. Looking ahead, HELLER will continue to lead the development trend in the field of electronic smart manufacturing, creating greater value for global clients.