New Reflow Oven for SMT Custom Electronics Manufacturing - pic

New Reflow Oven for SMT Custom Electronics Manufacturing Solutions

New Reflow Oven from HELLER Enhances SMT Capabilities for Silicon Mountain Contract Services

Silicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability in its Nampa facility with the addition of a new reflow oven – a HELLER 2043 MK5 10 zone oven .

The HELLER 2043 MK5 convection reflow oven represents industry-leading technology for high-volume, high-precision reflow soldering. Key features include:

  • 10 heated convection zones plus 3 cooling zones, delivering exceptional thermal uniformity and control for complex PCBA assemblies
  • Advanced energy-efficiency features, reducing nitrogen and electricity consumption by up to 40%
  •  Built-in thermal monitoring and energy management systems designed to maintain tight temperature delta-T specifications

As part of SMCS’s expanded SMT line, this oven complements integrated in-line AOI and advanced X-ray inspection capabilities. Together, these systems ensure accurate solder profiles, robust assembly quality, and efficient process flows.

With electronics designs growing in density and complexity, PCBA manufacturers require precise reflow control, rapid production scalability, and reliable inspection. The HELLER 2043 MK5 helps SMCS meet those needs by:

Achieving consistent, high-reliability solderingon dense assemblies
Maintaining tight thermal profiles essential for BGAs, QFNs, and µBGAs
Reducing rework and energy costs through modern process optimization
Delivering trust and performance to OEMs in instrumentation, defense, medical, and industrial sectors

“Adding the HELLER 2043 MK5 is more than an upgrade, it’s a statement,” said Eddie Garcia, Operations Manager at SMCS. “It demonstrates our commitment to quality, efficiency, and readiness to support the most demanding, high-density PCBA programs.”

This article was first published on Global SMT & Packaging on July 17th, 2025

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