Comprehensive Thermal Solutions – Heller Industries at Productronica Munich 2025

At Productronica Munich, Heller Industries demonstrated its commitment to advancing SMT and advanced packaging processes with cutting-edge thermal solutions. In an interview with GlobalSMT, our European Managing Director, Joe Balacky, explained how Heller is addressing key industry challenges such as throughput bottlenecks and process reliability.

Short Cycle Vacuum Reflow: Speed Meets Precision
Traditional vacuum reflow processes often face cycle time limitations. Heller’s Short Cycle Vacuum Reflow technology changes the game by integrating accelerated conveyors before and after the vacuum chamber, reducing cycle times to as low as 30 seconds—comparable to standard reflow speeds, but with the added benefits of vacuum for void reduction and improved solder joint integrity.

Pressure Curing Ovens: Eliminating Voids for Advanced Packaging
For applications like underfill curing in microBGAs, Heller’s Pressure Curing Oven applies controlled pressure and heat to eliminate air bubbles and cavities, ensuring maximum reliability in high-density assemblies. Designed for automation, this system supports magazine loading and EFEM integration, making it ideal for high-volume production environments.

These innovations reflect Heller’s mission to deliver faster, smarter, and more reliable thermal solutions for next-generation electronics manufacturing.