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Insufficient Solder

Defect: insufficient solder

The solder joint is incomplete resulting in an open circuit or a weak interconnection.

Process and design-related causes of insufficient solder:

  • Non-coplanar leads on the component
  • Excessive warpage of the PCB or substrate
  • Poor wetting
  • Insufficient amount of solder due to improper printing parameters
  • Skips in the printed solder due to blocked stencil aperture
  • Misaligned solder print
  • Improper stencil thickness
  • Inadequate stencil aperture size
  • Excessive pad size
  • Via in pad draining solder from interconnection

Reflow-related causes of  insufficient solder:

  • Preheat too aggressive
  • Peak reflow (liquidus) temperature not being attained
  • Malfunctioning oven which is impeding attenuation of proper temperatures


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