Re-printed in partnership with ITM Insufficient Solder Defect: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in […]
Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow […]
Heller Industries Customer Support Worldwide Support Request Warranty Replacement Global Video-Linked Service – For Heller reflow oven users operating in all areas of the world, direct access to factory-based support has been available for four years. The company’s Remote Modem-Accessible Technical Support (RMATS) program allows Heller factory-based engineers to access any oven’s internal electronic system. […]
Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Heller Industries – Software Downloads Please contact us for downloads Heller Software Products Heller 365 – Heller 365 is an SPC and traceability software package offer in 3 levels: Level 1 – (Traceability) Includes logging of all products run, oven parameters, CpK Level 2 – (Sensor-less Profile Monitoring) Includes Level 1 plus profile monitoring […]
Vertical Curing Ovens With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. In-line, vertical automation of the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the […]
Pressure Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries. Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy […]
As an established leader, manufacturer, and pioneer in the SMT reflow soldering oven market, Heller Industries continues to excel through its continuous innovation and customer-centric mindset. The company continues its agility and adaptability, maintaining production and processes throughout the COVID-19 pandemic, delivering industry-leading ovens that guarantee the lowest total cost of ownership, with a 40% […]