Void Free Curing with Pressure Today’s increasing durability and reliability standards are making void free curing a necessity. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to […]
Pressure Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
Voidless / Vacuum Reflow Soldering Ovens We offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for all volumes of production from R&D to HVM. To see how our vacuum reflow soldering ovens can help your process, email us at VacuumTest@hellerindustries.com for a free vacuum reflow demo and […]