Void Free Curing with Pressure Today’s increasing durability and reliability standards are making void free curing a necessity. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Vertical Curing Ovens With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. In-line, vertical automation of the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the […]
Pressure Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
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