WhenOctober 7–8, 2026
SMTA Guadalajara Expo & Tech Forum
Two complementary soldering solutions. One booth.
See Heller vacuum reflow and SEHO selective soldering technology together—and talk directly with
both teams about reliability, throughput, and process control.
Live at the show
A broader view of your soldering operation
Heller and SEHO bring complementary process technologies and application expertise together for
electronics manufacturers evaluating more than one production challenge.
Heller Industries
2043MK5-VR
Vacuum reflow oven
Request Spec Sheet & Technical Presentation
Vacuum reflow supports low-void, high-reliability soldering while maintaining the thermal process
control required for demanding assemblies.
- Void reduction for reliability-critical solder joints
- Controlled thermal processing for complex assemblies
- Designed for production environments requiring repeatable results
On display
SEHO Systems
PowerSelective
Selective soldering system
A flexible selective soldering platform for high-volume production and through-hole or
mixed-technology assemblies.
- Selective miniwave and dip soldering processes
- Flexible configuration for changing production requirements
- Options to combine soldering methods and complementary process steps
On display
Ask about Heller innovation
Short-Cycle Vacuum Reflow
More throughput. No shortcuts on vacuum performance.
Vacuum cycle time includes both the required vacuum process and the time spent transferring an
assembly into and out of the chamber. Simply reducing vacuum time can compromise void performance.
Heller’s SCVR approach uses a multi-stage, speed-adjustable conveyor system to minimize
non-value-added transfer time before and after the vacuum chamber—helping manufacturers pursue both
low-void performance and volume-production productivity.
01Preserve the vacuum process
02Reduce transfer time
03Improve production flow
Bring your process questions
Talk with both teams about your application
Void reduction
Discuss vacuum reflow strategies for reliability-critical soldering.
Throughput
Evaluate process flow and transfer-time optimization for volume production.
Thermal profiling
Review control requirements for demanding assemblies and process windows.
Selective soldering
Explore flexible processing for through-hole and mixed-technology products.
October 7–8, 2026 · Guadalajara, Jalisco
See both systems live in Booth 938.
Meet the Heller and SEHO teams at Expo Guadalajara, Salón Jalisco, Halls D & E.
