Void Free Soldering with Vacuum Assisted Reflow

High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards.
Voids in solder joints can lead to many undesirable issues such as

• Device overheating
• Reduced electrical performance
• Reduced RF performance for high-frequency applications
• Lower overall reliability

Voids can be effectively removed with vacuum assisted reflow.

• Trapped gas bubbles increase in size as pressure is reduced.
• Larger bubbles combine with other bubbles and ultimately collide with the edge of liquid solder to escape.
• Larger bubbles are accelerated by stronger buoyancy forces making them more likely to escape.

Normal Reflow

Vacuum Reflow

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