SMT Reflow Oven – 1911MK5-VR
Heller’s vacuum reflow oven utilizes a vacuum chamber placed in the oven’s relfow zone, which provides a
controlled pump down (up to 5 separate steps with closed-loop pump control) resulting in significant
reductions to void rate (<1% for many applications) with zero solders platter. The horizontal, in-line architecture makes it suitable for automated high throughput production.
Highlights:
Low Void Rate, down to 1%
Highest UPH: Heller released a patented vacuum oven in 2022 that increases UPH (unit per hour) up to
100% by shortening the board transfer time while ensuring the same heating performance and vacuum
performance. The innovative design with multi-stage conveyer belt design makes this Heller
Short-Cycle Vacuum Reflow Oven the top solution to tackle industry bottlenecks.
No Solder or Flux Splatter: Closed loop control for a controlled multi-step pump down and re-fill
prevents solder or flux spatter that occurs with single stage, open-loop vacuum systems.
Infra-red heaters in vacuum chamber allows peak temperatures to be reached inside the vacuum chamber
Easy clean mode that takes only 30 minutes
Reduced Nitrogen consumption
Oven CPK reporting software
Specifications
| Oven Length (cm) | 590cm |
| Process Gas Options | Air, Nitrogen, Formic Acid, forming gas |
| Heated Zones | Convection: 10 Top / 9 Bottom IR: 3 Top |
| Heated Length (Convection/Total) | 282 cm / 351 cm |
| Cool Zones | 3 Top (Bottom Option) |
| Max Working Temperature (Convection / IR) | Standard: 350°C , 480°C Optional |
| Min Vacuum | Standard: 10 Torr Option: < 1.5 Torr |
| Max Board Size | 50 cm × 45 cm |
| Cleanroom Option | Down to Class 1000 |
Video
