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1707 MK5 Reflow Soldering Oven

Small Footprint Reflow Soldering Oven Designed for Low Cost of Ownership

Reflow Soldering Oven MK5 1707 for SMT photo

The 1700 reflow soldering oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

  • The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy printed circuit board loads.
  • Wide process window for “universal profiling” – allows many different printed circuit boards to be run on a single temperature profile
  • Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 reflow profile graphs

Features and benefits of 1707 SMT reflow system

New Flux System Virtually Eliminates Maintenance

This new flux collection system traps the flux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the pcb flux and can be removed while the reflow oven is running for the ultimate in time savings!

Enhanced Heater Modules

Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!

Ultra-Parallel Conveyor System

Four (4) lead screws ensures the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges!

Fastest Cooling Rates

reflow soldering oven cooling photo
The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775! That rate meets even the most demanding lead-free profile requirements!

Process Control

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy. [more]

New Frame

More than simply beautiful, this new frame utilizes twice the insulation. This modification alone, reduces heat loss and saves up to 40% on electricity costs!

Lead Free Certified

More Lead free product has been run on Heller machines than any other! We have pioneered the Lead Free Reflow process by working closely with the Japanese OEM’s and International ODM’s and EMS’s to refine the Lead Free process. The Mark V system includes features that provide:

  • Spike Zone” design to minimize liquidous time
  • Ultra fast cooling rates of 3-5 Deg/Sec to form perfect grain structure
  • More heated zones than any other competitor to allow “Profile Sculpting”

Lowest Cost of Ownership

With the Balanced Flow Heater Module (BFM) technology the cost of running nitrogen has been reduced by up to 50%! And the LOW KW features have reduced Electrical consumption by up to 40%! Cost savings on nitrogen and electricity combined of $15,000 – $18,000 per year have been realized by our customers!

Best Return on Investment (ROI)

Total savings of $22,000 – $40,000 per year can be achieved with the new MKV system for the fastest ROI in the industry!
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Heller Industries, Inc.

4 Vreeland Road,

Florham Park, NJ 07932, USA

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