Heller Industries to Highlight Comprehensive Thermal Processing Portfolio at SMTA International 2026
Florham Park, NJ – August 2026– Heller Industries, a global leader in thermal processing solutions, will exhibit at SMTA International 2026, taking place October 25–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. The exhibition will be held October 27–29, where attendees are invited to visit Heller Industries in Booth 2521 to learn more about the company’s extensive portfolio of thermal process technologies.
Representing Heller at the event will be Caleb Eagle, Eastern Regional Sales Manager, who will be available to meet with manufacturers, engineers and industry partners to discuss current production requirements, emerging process challenges and the Heller technologies best suited to their applications.
“SMTA International brings together the people who are solving some of the electronics industry’s most demanding manufacturing challenges,” said Eagle. “Heller’s strength is that we are not limited to one type of thermal process. Whether a customer is focused on conventional SMT reflow, reducing voiding, improving curing productivity or developing a more advanced packaging process, we can work with them to identify a solution built around their specific manufacturing requirements.”
Heller’s product portfolio spans technologies for traditional electronics assembly as well as increasingly demanding high-reliability, power electronics and advanced packaging applications.
Visitors to Booth 2521 can speak with the Heller team about solutions including:
- Convection Reflow Ovens: Multiple platforms, including MK7, delivering high throughput with strong temperature uniformity, energy efficiency, flux control, and process stability.
- Vacuum and Voidless Reflow: Systems designed to reduce solder voiding, available in configurations from R&D to high-volume production.
- Formic Acid and Fluxless Reflow: Controlled formic vapor processing for flux-free oxide removal, with optional vacuum capability for further void reduction.
- Pressure Curing: Multi-size systems for R&D and production that use pressure to reduce voiding and improve adhesion.
- Vertical Curing: In-line vertical systems that boost productivity while minimizing floor space, ideal for cleanroom environments.
- Advanced Packaging and Custom Thermal Solutions: Thermal systems for semiconductor packaging, including formic, vacuum/formic, and underfill curing, plus custom process solutions.
This breadth enables Heller to support manufacturers as thermal requirements evolve across electronics assembly, high-reliability manufacturing, power electronics and semiconductor packaging.
“Our customers’ requirements continue to become more diverse,” Eagle added. “Some are focused on higher throughput and lower operating costs in traditional reflow, while others are dealing with voiding, advanced materials, curing requirements or entirely new packaging architectures. Having such a broad thermal processing portfolio allows us to approach those conversations from the application first rather than trying to fit every customer into the same technology.”
Attendees are encouraged to stop by Booth 2521 to meet with Caleb and the Heller Industries team, discuss current or upcoming thermal process requirements, and learn more about Heller’s complete portfolio of reflow and curing technologies.
For more information, visit www.hellerindustries.com.
About Heller Industries
Heller Industries is a global leader in advanced thermal processing equipment for the electronics and semiconductor industries. Headquartered in Florham Park, New Jersey, the company designs and manufactures high-performance reflow ovens, curing systems, and precision thermal solutions used in printed circuit board assembly, semiconductor packaging, and advanced electronics manufacturing worldwide.
Media Contact:
Paul Lancaster
Vice President of Sales & Marketing
Heller Industries
plancaster@Hellerindustries.com
