…17oC – 23oC) Cooling water pressure: 25 – 40 psi Pressure Cure Applications: Composite Forming for the printing industry Die Attach Curing Wafer Laminating Thermal Compress Bonding Underfill Curing Via Filling Film & Tape Bonding Manual loading batch Pressure Curing Oven for magazines Oven Size (mm): 2,200[L] x 1,700[W] x 1,700…