
David Heller is a recognized leader in advanced electronics manufacturing, with over 35 years of experience driving innovation in soldering, curing, and semiconductor packaging technologies. As CEO of Heller Industries Inc., he has overseen the company’s evolution into a global provider of high-performance thermal processing systems, serving industries ranging from SMT and mobile device assembly to advanced semiconductor packaging.
David holds a Bachelor of Science in Mechanical Engineering from Cornell University and an MBA from Harvard Business School. His early career included engineering and operations roles at General Motors and Chrysler Corporation, where he gained foundational expertise in emissions testing, manufacturing engineering, and powertrain operations.
Since taking the helm at Heller Industries in 1987, David has led the development and commercialization of numerous breakthrough technologies, including:
Under his leadership, Heller Industries implemented Lean manufacturing practices in the mid-1990s, resulting in significant operational efficiency and market share growth during the 1999–2000 technology expansion. He also spearheaded the company’s global manufacturing transition, establishing facilities in New Jersey (USA), Suwon (Korea), Shanghai (China), and Ahmedabad (India) to support regional demand and reduce lead times.
David has played a pivotal role in expanding Heller’s presence in the semiconductor packaging sector, aligning product development with the evolving needs of Tier 1 customers. His focus on cross-functional team building and process optimization has enabled Heller to meet stringent performance and reliability requirements in high-density packaging environments.
In addition to his executive role at Heller Industries, David serves as an advisor to companies in technology, materials science, and medical devices, offering strategic insights into scalable manufacturing and product innovation.
Articles And White Papers By Dave Heller: