HELLER Debuts at Zhengzhou for Advanced Technology Sharing
The Annual Conference of Henan Electronic Intelligent Manufacturing Industry Alliance and the 92nd CEIA China Electronic Intelligent Manufacturing Summit Forum were successfully held in the Zhengzhou Huawise Hotel. The conferences focused on fields such as instruments, smart factories, 5G communications, and others, which received the attention of many industry insiders. More than 400 industry colleagues attended the conference.
HELLER was invited to participate in the conference, which was also their first official appearance in Zhengzhou. Zhengzhou is an important city in central China, where the intelligent manufacturing industry is developing rapidly. Heller looks forward to more opportunities for cooperation in the future.
During the conference, Mr. Shen, a sales manager for HELLER, shared technology information with his talk “How to Eliminate Void in Reflow Welding Process”. In this speech, Mr. Shen focused on how to eliminate voids in the welding process. Specific examples in practical applications were provided, as well as solutions on how to eliminate voids. He further explained the working principle of vacuum reflow soldering and the compatibility of HELLER equipment with Industry 4.0.
HELLER sales Manager Mr. Shen delivers a speech.
About Heller Industries:
Heller Industries develops world-class soldering and curing equipment that services the SMT, consumer electronics assembly, power electronics and semiconductor advanced packaging industries. As a technology leader in the industry, we provide customized and innovative solutions for a wide range of customer requirements.
