Home » HELLER Presents The Benefits of Vacuum Reflow Soldering for High-Reliability Applications at the Ningbo Seminar

HELLER Presents The Benefits of Vacuum Reflow Soldering for High-Reliability Applications at the Ningbo Seminar

Ningbo, China – November 2, 2023: HELLER, a powerhouse in reflow soldering equipment, presented vacuum reflow soldering solutions at the Ningbo seminar, held by the Step by Step New Technology. The event gathered electronics manufacturing experts to explore the latest industry trends and developments.

During the seminar, HELLER’s Sales Manager, Shen Hounan, gave a compelling presentation showcasing the company’s innovative technology and solutions, with a key focus on the benefits of vacuum reflow soldering for high-reliability applications. Using a clear and engaging approach, Shen helped attendees grasp the principles and advantages of this cutting-edge soldering technique.

The seminar was a resounding success, with attendees praising HELLER’s products and solutions. At HELLER, the dedication to providing customers with the best possible reflow soldering solutions is unwavering. This dedication fuels continuous investment in research and development, ensuring a steady stream of pioneering products and technologies for the market.

“We’re truly grateful for the unwavering support of our customers and partners throughout the year,” expressed Shen. “We look forward to collaborating with them on developing even more innovative solutions that address their evolving needs.”

HELLER Presents The Benefits of Vacuum Reflow Soldering for High-Reliability Applications at the Ningbo Seminar photo
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