HELLER Received Recognition at Foxconn Technology Conference and Shared Innovative Research on Vacuum Soldering Technology
Foxconn 2024 SMT Advanced Technology Exchange Conference – Shenzhen
Shenzhen, China – November 15, 2024, the world’s leading electronics manufacturing service provider Foxconn held the highly anticipated “2024 SMT Advanced Technology Exchange Conference” at its Longhua Park in Shenzhen.
This conference focused on industry standards, advanced technologies, and intelligent manufacturing for products such as System-in-Package (SiP), Electric Vehicles (EV), and Artificial Intelligence (AI). Over 600 SMT professionals from various Foxconn Technology Group factories actively participated in the event, discussing the trends and technological innovations in the field of electronic manufacturing.
HELLER, as a globally renowned reflow soldering manufacturer, was also invited to participate in this grand event and delivered an excellent speech titled “Innovative Exploration of High Reliability Vacuum Soldering Process”.
Mr. Zhu, Product Director of HELLER, gave a clear and insightful presentation on our innovative research achievements in high reliability vacuum soldering technology. Vacuum soldering technology, as an advanced manufacturing process, can effectively improve soldering quality, reduce production costs, and is playing an increasingly important role in the automotive electronics field. HELLER’s innovative exploration not only enhances the efficiency and reliability of vacuum soldering but also brings new solutions to the electronic manufacturing industry.
Upon the conclusion of the speech, HELLER was awarded the honorary title of “2024 Foxconn Intelligent Manufacturing Ecosystem Partner” for its outstanding contributions to high-reliability vacuum soldering processes. This honor is a high recognition of HELLER’s achievements in technological innovation and industry collaboration, further cementing HELLER’s leading position in the global electronics manufacturing field.
The Foxconn SMT Advanced Technology Exchange Conference not only provides a platform for exchange and learning for industry experts but also creates more opportunities for cooperation among partners. HELLER’s participation and award-winning success once again demonstrate its strength and influence in the field of electronics manufacturing. In the future, HELLER will continue to commit to technological innovation, providing higher quality products and services to global customers, and jointly promoting the sustained development of the electronics manufacturing industry.
