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Other Curing Ovens

Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for both R&D and high volume manufacturing applications. Multiple cleanroom and automation options are available.

The Heller curing oven HCO N2-02 offers in-line processing curing for panel applications with a high productivity 2 magazine capacity.

The Heller curing oven HCO N2-04 offers high productivity with in-line processing for panel applications with a high 4 magazine capacity.

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