Convection Reflow Ovens Founded in 1960, Heller Industries, pioneered convection reflow ovens for pcb reflow soldering in the 1980s. Over the years, we have worked in partnership with our customers to continually refine systems to satisfy advanced application requirements. By embracing challenge and change, our convection reflow ovens continue to be the leader in Reflow […]
Florham Park, NJ ― November 2021 ― Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022. Heller Industries continues to push the envelope of leadership in oven technology. A pioneer […]
The 2021 Service Excellence Award for Soldering Equipment was won by Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers. “We are proud to receive this prestigious award for Soldering Equipment. It is especially gratifying since this honor comes from the CUSTOMERS themselves.” commented Marc […]
This new reflow oven platform revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to see across the production floor. We invite you to visit any of our […]
Heller Industries USA Regional Network Heller Industries Headquarters and Eastern Region 4 Vreeland Road, Florham Park, NJ 07932, Tel: +1-973-377-6800 Ext 314 President: Marc Peo VP Sales, Americas: Keith Virden Manager, Service: Bilal Mahli Manager, Eastern Region: Caleb Eagle Manager, Western USA Region: Keith Virden, Manager Western Region Manager, Canada: Caleb Eagle SERVICE Tel: +1-973-377-6800, Fax: +1-973-377-3862, E-mail: info@hellerindustries.com Heller Industries Western Region SALES […]
Semiconductor Advanced Packaging Heller Industries offers multiple equipment solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, […]
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to the electronics manufacturing industry! When: Thursday, August 29th, 8:30am-4:00pm (US Eastern) Where: Embassy Suites, Independence, Ohio Agenda: 8:30am – Registration Opens 9:00am – Technical Presentation, Mitigation of Tombstoning – User Success Story, Jerry Baterina, Rockwell […]
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to the electronics manufacturing industry! When: Tuesday, August 27, 2024, 8:30am-3:30pm (US Eastern) Where: Laurel Manor, 39000 Schoolcraft Rd, Livonia, Michigan Agenda: 8:30am – Registration Opens 9:00am – Technical Presentation, Mitigation of Tombstoning – User Success […]
HELLER, a leader in reflow oven technology, took center stage at the 2023 Foxconn Automotive Electronics Intelligent Manufacturing and Advanced Technology Conference. HELLER’s dedication to excellence was recognized with the “2023 Digital Foxconn Ecosystem Partner” award. This award signifies their commitment to collaboration, continuous innovation, and green technology. [More]
On October 11, 2023, the prestigious “Step by Step Excellence Awards” (SbSEA), formerly known as the Vision Awards, were ceremoniously held at the NEPCON Asia exhibition in Shenzhen. The award-winning product was carefully chosen by a panel of renowned experts in the electronic manufacturing industry and a group of dedicated readers of SbSTC. HELLER’s High […]