Pressure Curing Oven – PCO 700 Oven Size (mm): 1,800[L] x 1,350[W] x 1,750[H] Chamber Usable Area (mm): 500[L] x 460[W] x 460[H] Max Operating Pressure: 8 bar (116 psi) Max Operating Temperature: 200⁰ C Nitrogen Enabled (option) Up to Cleanroom Class 1000 (option) Vacuum down to 10 Torr (option) Manual Loading Chamber Dimensions System […]
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H] Chamber Usable Area (mm): 350[L] x 350[W] x 227[H] Max Operating Pressure: 12 Bar (174 psi) Max Operating Temperature: 200⁰ C (Forced Air Convection) 350⁰ […]
Curing Ovens As a market leader, Heller has the versatility, flexibility and engineering capabilities to develop custom solutions for your individual curing requirements. Heller offers both batch-type and in- line curing ovens with a variety of form-factors and tool footprints. All Heller ovens offer extremely stable processing with Nitrogen, cleanroom, and automation options. Horizontal Curing […]
Company Of The Year Award (Soldering Equipment) 30th October, 2020 The 2020 Global Surface Mount Technology Soldering Equipment Award – Heller Industries Frost & Sullivan states that “New Jersey-headquartered Heller Industries (Heller) delivers high-performance and unmatched customer value through its reflow soldering technology. The company pioneered convection reflow soldering in the 1980s, and since then, […]
Power Electronics: Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements. As these power densities increase, proper thermal management becomes more and more vital in order to meet today’s tighter reliability standards. As a […]
Electronics Assembly High productivity curing ovens to fit your requirement. Heller ovens are widely used in the consumer electronics industry for epoxy curing processes with applications including assembly of mobile phone assembly, wearable electronics, and camera modules. Heller offers both horizontal reflow ovens and vertical curing ovens. All of which provide true in-line architecture for […]
Ask The Reflow Soldering Experts Welcome To Ask The Experts!! In this section we encourage your questions, input and feedback on any Reflow Soldering Process issues that affect your organization. We may not have all the answers – but we’ll do our best to provide quick replies and at least point you in the right […]
520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with forced convection. Heaters, heat exchangers and blowers are internal to the pressure […]
Increase Productivity, Improve Quality, Reduce Costs… With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. Just as we pioneered SMT solder reflow advances, including full convection and economical nitrogen usage, we are now the first to offer a family of customized […]
The 2020 Global Surface Mount Technology Soldering Equipment Award – Heller Industries Frost & Sullivan states that “New Jersey-headquartered Heller Industries (Heller) delivers high-performance and unmatched customer value through its reflow soldering technology. The company pioneered convection reflow soldering in the 1980s, and since then, Heller has set the gold standard for SMT reflow ovens, […]