Re-printed in partnership with ITM Tombstoning PCB Soldering Tombstoning PCB Soldering Problems A type of open, known by a number of names (including crocodiling, surfboarding, Manhattan effect, drawbridging, Stonehenge effect, billboarding, etc.). This is a soldering defect in which a chip has been pulled into a vertical or near-vertical position with only one side soldered to […]
Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Heller Industries – Software Downloads Please contact us for downloads Heller Software Products Heller 365 – Heller 365 is an SPC and traceability software package offer in 3 levels: Level 1 – (Traceability) Includes logging of all products run, oven parameters, CpK Level 2 – (Sensor-less Profile Monitoring) Includes Level 1 plus profile monitoring […]
Vertical Curing Ovens With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. In-line, vertical automation of the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the […]
Pressure Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries. Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy […]
As an established leader, manufacturer, and pioneer in the SMT reflow soldering oven market, Heller Industries continues to excel through its continuous innovation and customer-centric mindset. The company continues its agility and adaptability, maintaining production and processes throughout the COVID-19 pandemic, delivering industry-leading ovens that guarantee the lowest total cost of ownership, with a 40% […]
As an established leader, manufacturer, and pioneer in the SMT reflow soldering oven market, Heller Industries receives repeated recognition for its excellence and on-time service delivery, which are two key factors that drive the global SMT reflow soldering equipment market. As more customers transition to Industry 4.0, Heller maintains its leading position by updating its […]
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top […]