The 2021 Service Excellence Award for Soldering Equipment was won by Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers. “We are proud to receive this prestigious award for Soldering Equipment. It is especially gratifying since this honor comes from the CUSTOMERS themselves.” commented Marc […]
Re-printed in partnership with ITM PCB Nonwetting Printed Circuit Board Nonwetting is a condition whereby a surface has contacted molten solder but has had part or none of the solder adhere to it. PCB Nonwetting is recognized by the fact that the base metal is visible. It is usually due to the presence of contamination on […]
Re-printed in partnership with ITM PCB Dewetting PCB Dewetting is a condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film and the base metal is not exposed. Process and design-related causes of PCB Dewetting: Solder paste flux […]
Re-printed in partnership with ITM Insufficient Solder Defect: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in […]
Heller Industries Customer Support Worldwide Support Request Warranty Replacement Global Video-Linked Service – For Heller reflow oven users operating in all areas of the world, direct access to factory-based support has been available for four years. The company’s Remote Modem-Accessible Technical Support (RMATS) program allows Heller factory-based engineers to access any oven’s internal electronic system. […]
Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Heller Industries – Software Downloads Please contact us for downloads Heller Software Products Heller 365 – Heller 365 is an SPC and traceability software package offer in 3 levels: Level 1 – (Traceability) Includes logging of all products run, oven parameters, CpK Level 2 – (Sensor-less Profile Monitoring) Includes Level 1 plus profile monitoring […]
Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries. Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy […]
The 2021 Service Excellence Award for Soldering Equipment was won by Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers. “We are proud to receive this prestigious award for Soldering Equipment. It is especially gratifying since this honor comes from the CUSTOMERS themselves.” commented Marc […]