The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise. The conference featured a lineup of over ten exciting topics, […]
April 27, 2023 – The Electronic Manufacturing Technology Committee of Shandong Electronics Society successfully hosted their Annual Conference alongside the 94th CEIA China Electronic Intelligent Manufacturing Summit Forum in Qingdao, Chian. The conference featured discussions on cutting-edge topics such as advanced packaging, smart factories, and smart home appliances. Over 300 professionals from the industry attended […]
February 28th, 2023 Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of convection reflow ovens and pressure curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region. The […]
1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min. The 1913MK7 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. Built-in Thermal Monitoring Nitrogen Capable to < 100 ppm Energy Management System Virtually No Maintenance […]
This new reflow oven platform revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to see across the production floor. We invite you to visit any of our […]
Fully Automatic Pressure Curing Oven – PCO 1300 A Fully automatic Pressure Curing Oven with 300mm EFEM. Oven Size (mm): 2,200[W] x 2,200[D] x 2,475[H] Chamber Usable Area (mm): 560[W] x 680[D] x 480[H] Max Operating Pressure: 20 bar (290 psi) Max Operating Temperature: 260⁰ C Nitrogen Enabled (option) Cleanroom Class 100 (option) Vacuum down […]
In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x 2,400[H] Max Operating Pressure: 10 bar (145 psi) Max Operating Temperature: 220⁰ C Nitrogen / CDA Cleanroom Class 1000 Vacuum capability down to 10 Torr […]
Pressure Curing Oven – PCO 1150 Manual loading PCO for curing PLP panels. Oven Size (mm): 2,000[W] x 2,300[D] x 2,300[H] Max Operating Pressure: 10 bar (145 psi) Max Operating Temperature: 220⁰ C Nitrogen / CDA Cleanroom Class 1000 Vacuum capability down to 10 Torr Manual Loading (PLP Panel Magazine) 1 Magazine Capacity PLP Panel […]
Pressure Curing Oven – PCO 700 Oven Size (mm): 1,800[L] x 1,350[W] x 1,750[H] Chamber Usable Area (mm): 500[L] x 460[W] x 460[H] Max Operating Pressure: 8 bar (116 psi) Max Operating Temperature: 200⁰ C Nitrogen Enabled (option) Up to Cleanroom Class 1000 (option) Vacuum down to 10 Torr (option) Manual Loading Chamber Dimensions System […]
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H] Chamber Usable Area (mm): 350[L] x 350[W] x 227[H] Max Operating Pressure: 12 Bar (174 psi) Max Operating Temperature: 200⁰ C (Forced Air Convection) 350⁰ […]