The 2020 Global Surface Mount Technology Soldering Equipment Award – Heller Industries Frost & Sullivan states that “New Jersey-headquartered Heller Industries (Heller) delivers high-performance and unmatched customer value through its reflow soldering technology. The company pioneered convection reflow soldering in the 1980s, and since then, Heller has set the gold standard for SMT reflow ovens, […]
November 2021 ― Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022. Heller Industries continues to push the envelope of leadership in oven technology. […]
Reflow Soldering Solutions for Reflow Soldering Problems The reflow soldering profile The reflow soldering profile must be matched to the specific requirements of the solder paste as well as the thermal thresholds of the PCB assembly. It is essential that accurate profiling be achieved and thus use of an accurate data recording system as well as a […]
Heller Industries Customer Support Worldwide Support Request Warranty Replacement Global Video-Linked Service – For Heller reflow oven users operating in all areas of the world, direct access to factory-based support has been available for four years. The company’s Remote Modem-Accessible Technical Support (RMATS) program allows Heller factory-based engineers to access any oven’s internal electronic system. […]
Void Free Curing with Pressure Today’s increasing durability and reliability standards are making void free curing a necessity. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to […]
Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Fluxless/Formic Reflow Ovens Heller has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Our Formic Reflow Process. These formic reflow ovens operate like a normal reflow oven with the addition of formic […]
Florham Park, NJ ― November 2021 ― Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022. Heller Industries continues to push the envelope of leadership in oven technology. A pioneer […]
Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries. Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy […]