Kuala Lumpur, Malaysia – From May 28 to 30, HELLER, together with its partner ZMC, jointly participated in SEMICON Southeast Asia (Malaysia International Semiconductor Exhibition). As the largest semiconductor equipment event in Southeast Asia, SEMICON SEA provides valuable opportunities for exhibitors to showcase cutting-edge technologies, exchange industry trends, and expand business networks. It is worth […]
Recently, HELLER, a leading global provider of electronic manufacturing solutions, made a great impression at the highly anticipated NEPCON China electronics manufacturing exhibition. HELLER attracted the attention of many exhibitors and industry observers with its excellent technical strength and innovative solutions. As the most influential electronics manufacturing event in Asia, NEPCON has gathered many industry […]
HELLER concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note.
HELLER’s High UPH Vacuum Reflow Soldering Oven Innovation Award owing to its industry-leading product strength and outstanding performance.
Reflow Oven Flux Removal System – Low Temperature Catalyst Clean flux removal – No liquid or solid waste generated. No harmful exhaust. Does not require additional power, reduces overall power use. Catalyst reaction reduces O 2 PPMs, reducing nitrogen use. Doubles PM interval No impact to thermal profile How it Works The reflow oven flux […]
From July 19-21, 2023, the highly anticipated NEPCON China 2023 took place at the prestigious Shanghai World Expo Exhibition Hall, marking a resounding success. Among the prominent participants, HELLER, renowned for its leadership in the reflow soldering market, was graciously invited to partake in this grand exhibition.
Fluxless reflow with formic acid offers numerous benefits, including higher yields by eliminating flux-related defects, reduced floor space requirements with the removal of flux-related equipment, as well as reduced energy use and operating costs. While setting up a formic reflow process is similar to a standard reflow process, there are a few additional things that […]
With today’s increasing demands on device reliability, vacuum reflow soldering is now seen as the industry’s choice for solder void mitigation. While vacuum reflow soldering works very similar to normal reflow soldering, there are a few key things users should be aware of. An Effective Vacuum Assisted Reflow Process for Void Removal Certain components have […]
17 Zone Reflow Oven -2156 MK7 The 2156 MK7 17 reflow oven is a high volume reflow oven system with 17 heated zones and belt speeds up to 1.88m/min. The 2156 MK7 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. The 12” wide heater modules offer profile compatibility […]
2049 MK7 Reflow Oven System The 2049 MK7 is a high volume reflow oven system with 15 heated zones and belt speeds up to 1.88m/min. The 2049 MK7 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. The 12” wide heater modules offer profile compatibility with competitor systems. Built-in […]