Re-printed in partnership with ITM Insufficient Solder Defect: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in […]
Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow […]
Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp Excessive Heating Rate Preheat Temp Low Solder Paste Oxidation Screen/Stencil Clogged Insufficient Solder Paste Oxidized Solder Paste Paste Viscosity Too Low Misaligned Component Excess Solder Deposition […]
Void Free Curing with Pressure Today’s increasing durability and reliability standards are making void free curing a necessity. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to […]
Void Free Soldering with Vacuum Assisted Reflow High performance electronics and power devices are driving higher power densities. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced […]
Heller Magazine Curing Ovens Heller Industries is a leading provider of magazine curing ovens with a product line suitable for a wide range of applications. We offer both pressurized and non-pressurized magazine ovens in both batch-type and in-line formats. All magazine ovens are heated with forced air convection providing uniform heating throughout the magazine, and […]
Vertical Curing Ovens With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. In-line, vertical automation of the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the […]
Pressure Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
Voidless / Vacuum Reflow Soldering Ovens We offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for all volumes of production from R&D to HVM. To see how our vacuum reflow soldering ovens can help your process, email us at VacuumTest@hellerindustries.com for a free vacuum reflow demo and […]
6000W HEATER WIRE ASSY WHT,BLK wires – Use PN 590054 for heater elements only – Use PN 483985-01