520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with forced convection. Heaters, heat exchangers and blowers are internal to the pressure […]
Reflow Oven -MK7 New Reflow Oven for High-Throughput Applications The new MK7 reflow oven is a platform that revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to […]
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition. The 1936 Mark 5 reflow system delivers the highest level of repeatability with the lowest delta Ts. The latest breakthroughs associated […]
Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015. The 2043 Mark 5 reflow system delivers the highest […]
Heller aligns its product strategy with the rapid technological advances that impact customers’ changing requirement Based on its recent analysis of the global surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2020 Global Company of the Year Award. Leveraging a customer-centric mindset, a highly skilled engineering […]
Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of tin-copper forms. This is typically Cu6Sn5 or Cu5Sn6 and this intermetallic is what causes the solder to adhere […]
Re-printed in partnership with ITM Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow. This may be somewhat mythical and what little cracking is still observed usually tends to be due to defects in the manufacturing process of the capacitor. Cracking of plastic-molded packages, such as QFPs and BGAs, […]
Re-printed in partnership with ITM PCB Delamination PCB Delamination is a separation between any of the layers of the base material or between the laminate and the conductive foil, or both. Process and design-related causes of PCB Delamination: Improper fabrication of the PCB Improper packaging of PCBs during shipping Improper storage of PCBs resulting in excessive […]
Re-printed in partnership with ITM Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies. Process and design-related causes of circuit board voids: Improper solder volume due to improper […]
Re-printed in partnership with ITM Wicking Defects Defect: wicking A Wicking Defect is the flow of solder either up the lead of the component or along traces and possibly under insulation and through via holes. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in […]