VCO 755-350 Vertical Curing Oven Vertical Curing Oven with Cleanroom Ability Vertical curing oven with optional cleanroom capability able to handle boards or pallets up to 350mm x 350mm in size.. Oven Size (mm): 2500 (L) x 1800m (W) x 2000 (H) 4 Heated Zones Shelf Pitch: 31.75mm 36 Board Capacity (18 Up + 18 […]
Vertical Curing Oven VCO 722 Small Footprint Vertical Curing Oven A small footprint vertical curing oven with a single column requiring less than 4 feet of cleanroom space. Oven Size (mm): 1874(L) x 1150(W) x 2256(H) Single Column, 2 Heated Zones 22 Tray Capacity (22 Up + 0 Down) Shelf Pitch 38.1mm Cure Time: Up […]
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H] Chamber Usable Area (mm): 350[L] x 350[W] x 227[H] Max Operating Pressure: 12 Bar (174 psi) Max Operating Temperature: 200⁰ C (Forced Air Convection) 350⁰ […]
Used 1912EXL Reflow Oven Reflow Oven Model: 1912EXL DOM: July 2007 Condition: Inline with its age Quantity: 1 Price : $20,000 Transfer Direction: Left to Right Product installation requirements: Facilities: 480V 3ph 63A Dims: 232″ Reflow Oven Info: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video […]
SMT Reflow Oven for Solder Reflow Heller Industries offers several models of SMT convection reflow ovens to fit the need of any solder reflow process requirement. Our latest generation of SMT reflow ovens, the MK7 reflow oven , provides unparalleled performance with exceptional efficiency. A Green Manufacturing Solution The MK7 was designed with green manufacturing […]
Semiconductor Advanced Packaging Heller Industries offers multiple equipment solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, […]
Power Electronics: Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements. As these power densities increase, proper thermal management becomes more and more vital in order to meet today’s tighter reliability standards. As a […]
Heller Industries and the Environment Heller is committed to improving itself as an environmental leader in the design of its oven products and the use of its technology. We strive to minimize our environmental footprint and raise environmental consciousness in everything we do. While addressing environmental advances Heller has been able to provide its customers […]
Custom Reflow Soldering Oven or Curing Oven Custom reflow soldering oven or curing oven applications for special and challenging heating requirements Heller Industries is the worldwide leader in Thermal Processing. In addition to providing Advanced Technology Solutions for SMT Assembly, we also provide High Tech Thermal Solutions for the following industries and applications: Wafer Processing […]
Reflow Oven CPK Reflow Oven Process Monitoring SPC Data Gathering Tools and Oven CPK for the Ultimate in Process Control! Powered by ECD, this innovative software package provides three levels of process control from Reflow Oven CPK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast […]