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Heller Industries at SEMICON West 2026

Thermal precision for the next era of advanced packaging.

Meet Heller in San Francisco to discuss formic acid reflow, vacuum processing, pressure curing,
and customized thermal solutions engineered for demanding semiconductor packaging processes.

  • Advanced packaging
  • Precision process control
  • Global support

Thermal precision for the next era of advanced packaging. photo

Featured platform
MINERVA
Built for 2.5D / 3D packaging

WhenOctober 13–15, 2026
Meet HellerBooth 6813

Engineered around your process

Turn packaging challenges into controlled, repeatable production.

Advanced packaging raises the bar for temperature uniformity, atmosphere control, cleanliness,
low-void performance, and process stability. Heller brings application expertise and a portfolio
of thermal platforms designed to address those requirements at production scale.

Bring us your process challenge

Three paths to process confidence

Thermal solutions for advanced semiconductor packaging

Explore the platforms Heller will feature at SEMICON West, then meet with our team to map the right approach to your application.

01

Pressure Curing Oven

PCO-860

Pressure-assisted thermal processing for packaging materials and curing applications where
repeatability, process control, and production reliability matter.

  • Controlled pressure and thermal environment
  • Designed for demanding curing processes
  • Application-focused engineering support

Discuss pressure curing

PCO

Heller PCO-860 pressure curing oven

02

Formic Acid Vacuum Reflow

1911MK5-VFAR

Combine precise formic acid processing with vacuum reflow for fluxless, no-clean soldering and
low-void results in reliability-critical packaging applications.

  • Formic acid process capability
  • Vacuum-assisted void reduction
  • Production-ready thermal control

Explore VFAR for your process

VFAR

Heller 1911MK5-VFAR formic acid vacuum reflow oven

ADVANCED PACKAGING PLATFORM

Heller Minerva advanced formic acid reflow system

Designed for
2.5D / 3D
Advanced packaging

The featured platform

Meet Minerva.

Heller’s formic acid reflow platform combines vertical convection heating and cooling with multiple
independent process chambers to support stable, repeatable production for advanced packaging.

Microscope image showing fine-pitch micro-bumping results from the Minerva platform
Micro-bumping result
Bump pitch: < 15 μm
Minerva advanced packaging platform
01

Uniform thermal processing

Forced convection surrounds the wafer with uniform heated air, helping reduce wafer-to-wafer and within-wafer temperature variation.

02

Stable atmosphere control

Real-time monitoring tracks formic acid concentration, temperature, and oxygen content for high-reliability processing.

03

Low-vibration architecture

The wafer remains in place during processing, minimizing movement and associated vibration-related defects.

Wafer-level packagingFine-pitch micro-bumping
Chip-to-waferChip-to-panel die attach

Start with the process

What will you bring to Booth 6813?

Use your meeting to explore the thermal, atmosphere, cleanliness, and throughput requirements behind your next packaging program.

01

Temperature uniformity

Review wafer and package thermal requirements.

02

Atmosphere control

Discuss formic acid, oxygen, and process stability.

03

Void reduction

Evaluate vacuum and fluxless reflow strategies.

04

Custom engineering

Explore a solution built around your process.

Reserve time at SEMICON West

Book a focused conversation with Heller.

Select a convenient time to meet our team in Booth 6813. Tell us what you are working on, and we’ll
make the conversation as relevant as possible to your packaging process.

DateOctober 13–15, 2026
LocationMoscone Center · Booth 6813

Open booking calendar

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Heller VIP Meeting

Choose your time at SEMICON West.

View live availability and reserve a focused conversation with the Heller team through our
official Microsoft Bookings page.

OCT
13–15
2026
SEMICON West
Moscone Center
Heller Booth 6813

View available times

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Heller Industries, Inc.

4 Vreeland Road,

Florham Park, NJ 07932, USA

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