01
Form the interconnect
Reflow in a controlled atmosphere
Apply precise heat and atmosphere control when interconnects must form without excessive oxidation, temperature variation, warpage sensitivity, or vibration.
The leader of advanced packaging thermal solutions
Thermal precision for the next era of advanced packaging.
From fine-pitch interconnect reflow to low-void joining and pressure-assisted curing, Heller helps
semiconductor manufacturers match the right thermal process to each packaging stage.
- Formic acid reflow
- Vacuum processing
- Pressure curing
Advanced packaging portfolio
REFLOW · VACUUM · CURE
Engineered around your process
REFLOW · VACUUM · CURE
Engineered around your process
Start with the package, not the oven
Turn packaging challenges into controlled, repeatable production.
Thermal equipment enters the process at different points for different reasons: to reflow an
interconnect, reduce voiding in a joint, cure an underfill, or consolidate a pressure-assisted bond.
Heller combines application knowledge with a broad thermal portfolio so the equipment follows the
process requirement—not the other way around.
Where thermal processing fits
Three process stages. One application-led portfolio.
Use this guide to identify when a Heller thermal platform may enter your semiconductor packaging flow.
02
Control voiding
Create reliable joints and thermal paths
Use vacuum, formic acid, or pressure-assisted processing when voids can compromise solder joints, thermal conductivity, mechanical reliability, or package performance.
03
Cure and consolidate
Strengthen the material interface
Apply controlled pressure and uniform convection after dispense or placement to remove trapped gas, improve adhesion, and produce a stable cured or bonded interface.
Fine-pitch micro-bumpingFlip chipDie attach
Underfill curingWafer-level packaging2.5D / 3D packaging
Chip-to-waferChip-to-panelThermal interface materials
Silver sintering
Underfill curingWafer-level packaging2.5D / 3D packaging
Chip-to-waferChip-to-panelThermal interface materials
Silver sintering
Three paths to process confidence
Choose the thermal mechanism your process needs.
Heller’s semiconductor portfolio spans precision formic acid reflow, vacuum-assisted joining, and pressure curing. Each platform solves a different part of the package flow.
FORMIC ACID REFLOW PLATFORM
Best fit
Fine pitch
2.5D / 3D packaging
Fine pitch
2.5D / 3D packaging
Precision interconnect reflow
Minerva
Vertical forced-convection heating and cooling surround the wafer with uniform air, making the process less sensitive to wafer warpage than contact-heating methods while supporting precise temperature and formic acid control.
Bump pitch: < 15 μm
Minerva advanced packaging platform
Minimal warpage sensitivity
Forced convection wraps the wafer in uniform heated air instead of relying on contact heating.
Precision and stability
Within-wafer uniformity to ≤±2°C, real-time atmosphere monitoring, and formic acid concentration up to 12%.
Low vibration, high cleanliness
The wafer remains in place during processing; the mini-environment supports up to ISO 4 / Class 10 cleanliness.
VFAR
Formic Acid Vacuum Reflow
1911MK5-VFAR
An inline production platform combining formic acid processing with vacuum reflow for fluxless, no-clean soldering and void reduction in reliability-critical assemblies.
Core strengthLow-void, fluxless joining at production scale
- Formic acid atmosphere for oxide reduction
- Vacuum-assisted void removal
- Controlled inline thermal processing
Best for Die attach · Solder TIM · Power devices · High-reliability reflow
PCO
Pressure Curing Oven
PCO-860
Constant chamber pressure and forced-air convection provide consistent heating across the product, helping minimize voiding and increase adhesion strength in curing and bonding processes.
Core strengthVoid reduction and stronger material interfaces
- Uniform convection heating under pressure
- Optional vacuum removes larger voids before pressure removes smaller voids
- Atmosphere control and cleanroom options
Best for Underfill curing · Die attach · Silver sintering · TIM bonding
Why choose Heller
Application knowledge backed by thermal engineering depth.
Advanced packaging rarely fits a standard recipe. Heller brings process-focused engineering, configurable platforms, and a global support footprint to demanding production challenges.
Engineering-led
Nearly one-third of Heller’s workforce is dedicated to engineering, supporting demanding and highly customized thermal processes.
Portfolio breadth
Formic acid, vacuum, forced convection, pressure curing, and vertical curing technologies provide more than one path to a solution.
Process precision
Temperature uniformity, atmosphere stability, cleanliness, low-void performance, and repeatability are designed into the platform.
Global footprint. Local service.
Regional offices, service points, factories, and demo facilities help support customers where they operate.
Ask Heller
What do you need to know?
Tell us your application, material stack, process stage, or performance target. A Heller specialist can help identify which thermal mechanism and platform deserve a closer look.
Where should vacuum enter my process?
Which platform fits underfill curing?
How can I reduce warpage sensitivity?
What supports fine-pitch micro-bumping?
Which platform fits underfill curing?
How can I reduce warpage sensitivity?
What supports fine-pitch micro-bumping?
