520 Pressure Curing Oven
A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.
- PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
- Heaters, heat exchangers and blowers are internal to the pressure vessel.
- When the curing process is complete, the Pressure Curing Ovens automatically relieves its pressure to 1atm and cools.
Process Specification:
- Process time: Generally 120 min or User’s spec
- Operating temp: 60oC ~ 200oC
- Maximum temp: 220oC
- Operating pressure: 1 bar – 10 bar
- Capacity: 24 Magazines (typical)
- Cooling method: PCW (17oC – 23oC)
- Cooling water pressure: 25 – 40 psi
Pressure Cure Applications: - Composite Forming for the printing industry
- Die Attach Curing
- Wafer Laminating
- Thermal Compress Bonding
- Underfill Curing
- Via Filling
- Film & Tape Bonding
Manual loading batch Pressure Curing Oven for magazines
- Oven Size (mm): 2,200[L] x 1,700[W] x 1,700[H]
- Chamber Usable Area (mm): 716.5[L] x 608[W] x 440[H]
- Max Operating Pressure: 10 Bar (145 psi)
- Max Operating Temperature: 200⁰ C
- Typical Capacity: 24 Magazines
- Nitrogen Enabled (option)
- Up to Cleanroom Class 100 (option)
- Vacuum down to 10 Torr (option)
- Manual Loading