Heller Industries to Spotlight New Minerva Advanced Packaging Platform at SEMICON West 2026
Florham Park, NJ – August 2026– Heller Industries, a global leader in thermal processing solutions, will exhibit at SEMICON West 2026, taking place October 13–15 at the Moscone Center in San Francisco. Visitors are invited to meet with the Heller team in Booth 6813, where the company will place a major focus on its new Minerva Formic Acid Reflow Oven for advanced semiconductor packaging while highlighting its broader portfolio of thermal process solutions.
Designed specifically for demanding 2.5D/3D advanced packaging applications, Minerva combines precision formic acid process control with a vertical convection heating and cooling architecture and multiple independent process chambers. The platform is engineered to deliver exceptional wafer temperature uniformity while minimizing vibration-related defects and supporting stable, repeatable high-volume production.
“Advanced packaging is placing entirely new demands on thermal processing, particularly around temperature uniformity, atmosphere control, cleanliness and process stability,” said Paul Lancaster, Vice President of Sales & Marketing at Heller Industries. “Minerva was developed specifically around those requirements. SEMICON West gives us an ideal opportunity to meet with semiconductor manufacturers and packaging specialists to discuss how Heller’s thermal technologies can support their next-generation processes.”
Minerva incorporates precise and stable formic acid concentration and temperature control for high-reliability packaging applications. Intelligent real-time monitoring tracks formic acid concentration, temperature and oxygen content, while automatic formic acid replenishment is designed to support uninterrupted operation. The system can maintain oxygen levels below 5 ppm and monitor formic acid concentrations as high as 15%.
Its forced-convection thermal system surrounds the wafer with uniform heated air, helping reduce sensitivity to wafer warpage compared with contact-heating approaches while minimizing wafer-to-wafer and within-wafer temperature variation. Because the wafer does not need to move between stations during processing, the architecture also minimizes vibration and associated process defects.
The Minerva Formic Acid Reflow Oven is designed to support a range of advanced semiconductor packaging processes, including:
- 2.5D/3D packaging
- Wafer-level packaging
- Fine-pitch micro-bumping
- Chip-to-wafer and chip-to-panel die attach
In addition to Minerva, Heller representatives at SEMICON West will be available to discuss the company’s broader thermal processing portfolio for semiconductor advanced packaging, including formic/fluxless reflow, vacuum and voidless reflow, pressure curing, vertical curing and customized thermal processing solutions.
For more information about Heller Industries and its thermal processing solutions, stop by Booth 6813 at SEMICON West in October, or visit www.hellerindustries.com.
About Heller Industries
Heller Industries is a global leader in advanced thermal processing equipment for the electronics and semiconductor industries. Headquartered in Florham Park, New Jersey, the company designs and manufactures high-performance reflow ovens, curing systems, and precision thermal solutions used in printed circuit board assembly, semiconductor packaging, and advanced electronics manufacturing worldwide.
Media Contact:
Paul Lancaster
Vice President of Sales & Marketing
Heller Industries
plancaster@Hellerindustries.com
