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Curing Ovens As a market leader, Heller has the versatility, flexibility and engineering capabilities to develop custom solutions for your individual curing requirements. Heller offers both batch-type and in- line curing ovens with a variety of form-factors and tool footprints. All Heller ovens offer extremely stable processing with Nitrogen, cleanroom, and automation options. Horizontal Curing […]
Company Of The Year Award (Soldering Equipment) 30th October, 2020 The 2020 Global Surface Mount Technology Soldering Equipment Award – Heller Industries Frost & Sullivan states that “New Jersey-headquartered Heller Industries (Heller) delivers high-performance and unmatched customer value through its reflow soldering technology. The company pioneered convection reflow soldering in the 1980s, and since then, […]
Heller Industries USA Regional Network Heller Industries Headquarters and Eastern Region 4 Vreeland Road, Florham Park, NJ 07932, Tel: +1-973-377-6800 Ext 314 President: Marc Peo VP Sales, Americas: Keith Virden Manager, Service: Bilal Mahli Manager, Eastern Region: Caleb Eagle Manager, Western USA Region: Keith Virden, Manager Western Region Manager, Canada: Caleb Eagle SERVICE Tel: +1-973-377-6800, Fax: +1-973-377-3862, E-mail: info@hellerindustries.com Heller Industries Western Region SALES […]
Semiconductor Advanced Packaging Heller Industries offers multiple equipment solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, […]
Power Electronics: Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements. As these power densities increase, proper thermal management becomes more and more vital in order to meet today’s tighter reliability standards. As a […]
Electronics Assembly High productivity curing ovens to fit your requirement. Heller ovens are widely used in the consumer electronics industry for epoxy curing processes with applications including assembly of mobile phone assembly, wearable electronics, and camera modules. Heller offers both horizontal reflow ovens and vertical curing ovens. All of which provide true in-line architecture for […]
Ask The Reflow Soldering Experts Welcome To Ask The Experts!! In this section we encourage your questions, input and feedback on any Reflow Soldering Process issues that affect your organization. We may not have all the answers – but we’ll do our best to provide quick replies and at least point you in the right […]
Schedule a Reflow Soldering Equipment Demonstration We welcome you to visit any of our facilities – USA, Asia, Europe to get a closer look at our reflow soldering equipment & products and have all of your questions answered. To schedule now, please complete the form below. ( * required information).
520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with forced convection. Heaters, heat exchangers and blowers are internal to the pressure […]