The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise. The conference featured a lineup of over ten exciting topics, […]
April 27, 2023 – The Electronic Manufacturing Technology Committee of Shandong Electronics Society successfully hosted their Annual Conference alongside the 94th CEIA China Electronic Intelligent Manufacturing Summit Forum in Qingdao, Chian. The conference featured discussions on cutting-edge topics such as advanced packaging, smart factories, and smart home appliances. Over 300 professionals from the industry attended […]
The Annual Conference of Henan Electronic Intelligent Manufacturing Industry Alliance and the 92nd CEIA China Electronic Intelligent Manufacturing Summit Forum were successfully held in the Zhengzhou Huawise Hotel. The conferences focused on fields such as instruments, smart factories, 5G communications, and others, which received the attention of many industry insiders. More than 400 industry colleagues […]
February 28th, 2023 Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of convection reflow ovens and pressure curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region. The […]
HCO N2-04 -Inline Curing Oven The Heller curing oven HCO N2-04 offers high productivity with in-line processing for panel applications with a high 4 magazine capacity. Oven Size Including Loaders (mm): 5,670[W] x 2,470[D] x 2,210[H] 4 Magazine Capacity (510x515mm panels) Max Temp: 200C Nitrogen Environment with O2 Levels Down to 100ppm Cleanroom Class 1000 […]
Other Curing Ovens Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for […]
1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min. The 1913MK7 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. Built-in Thermal Monitoring Nitrogen Capable to < 100 ppm Energy Management System Virtually No Maintenance […]
HCO N2-02 -Heller Curing Oven The Heller curing oven HCO N2-02 offers in-line processing curing for panel applications with a high productivity 2 magazine capacity. Oven Size Including Loaders (mm): 4,550[W] x 3,110[D] x 2,340[H] 2 Magazine Capacity (510x515mm panels) Max Temp: 200C Nitrogen Environment with O2 Levels Down to 100ppm Internal Conveyor SECS/GEM Temperature […]
HMO 50 -Horizontal Magazine Curing Oven A horizontal in-line magazine curing oven with a magazine loader and unloader, and a magazine return conveyor system. Oven Size (mm): 3,300[W] x 1,650[D] x 2,500[H] Loader (mm): 1,050[W] x 1,500[D] x 2,100[H] Unloader (mm): 1,400[W] x 1,500[D] x 2,100[H] Bypass (mm): 3,000[W] x 500[D] x 950[H] Total Size […]
Established over six decades ago, Heller Industries pioneered convection reflow soldering in the 1980s for surface mount technology (SMT) and since has carried the moniker of a world leader in reflow oven technology. Today, the company also excels at semiconductor packaging and epoxy curing, making it a one-stop destination for thermal processing solutions on an […]