HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform […]
February 28th, 2023 Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of convection reflow ovens and pressure curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region. The […]
Fully Automatic Pressure Curing Oven – PCO 1300 A Fully automatic Pressure Curing Oven with 300mm EFEM. Oven Size (mm): 2,200[W] x 2,200[D] x 2,475[H] Chamber Usable Area (mm): 560[W] x 680[D] x 480[H] Max Operating Pressure: 20 bar (290 psi) Max Operating Temperature: 260⁰ C Nitrogen Enabled (option) Cleanroom Class 100 (option) Vacuum down […]
In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x 2,400[H] Max Operating Pressure: 10 bar (145 psi) Max Operating Temperature: 220⁰ C Nitrogen / CDA Cleanroom Class 1000 Vacuum capability down to 10 Torr […]
Pressure Curing Oven – PCO 1150 Manual loading PCO for curing PLP panels. Oven Size (mm): 2,000[W] x 2,300[D] x 2,300[H] Max Operating Pressure: 10 bar (145 psi) Max Operating Temperature: 220⁰ C Nitrogen / CDA Cleanroom Class 1000 Vacuum capability down to 10 Torr Manual Loading (PLP Panel Magazine) 1 Magazine Capacity PLP Panel […]
Pressure Curing Oven – PCO 700 Oven Size (mm): 1,800[L] x 1,350[W] x 1,750[H] Chamber Usable Area (mm): 500[L] x 460[W] x 460[H] Max Operating Pressure: 8 bar (116 psi) Max Operating Temperature: 200⁰ C Nitrogen Enabled (option) Up to Cleanroom Class 1000 (option) Vacuum down to 10 Torr (option) Manual Loading Chamber Dimensions System […]
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H] Chamber Usable Area (mm): 350[L] x 350[W] x 227[H] Max Operating Pressure: 12 Bar (174 psi) Max Operating Temperature: 200⁰ C (Forced Air Convection) 350⁰ […]
Semiconductor Advanced Packaging Heller Industries offers multiple equipment solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, […]
Electronics Assembly High productivity curing ovens to fit your requirement. Heller ovens are widely used in the consumer electronics industry for epoxy curing processes with applications including assembly of mobile phone assembly, wearable electronics, and camera modules. Heller offers both horizontal reflow ovens and vertical curing ovens. All of which provide true in-line architecture for […]
November 2021 ― Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022. Heller Industries continues to push the envelope of leadership in oven technology. […]