HELLER, a leader in reflow oven technology, took center stage at the 2023 Foxconn Automotive Electronics Intelligent Manufacturing and Advanced Technology Conference. HELLER’s dedication to excellence was recognized with the “2023 Digital Foxconn Ecosystem Partner” award. This award signifies their commitment to collaboration, continuous innovation, and green technology. [More]
Shenzhen, China – November 2, 2023: HELLER, a leader in reflow oven technology, took center stage at the 2023 Foxconn Automotive Electronics Intelligent Manufacturing and Advanced Technology Conference. Not only did they showcase their innovative solutions, but they were also awarded the prestigious “2023 Digital Foxconn Ecosystem Partner” award, solidifying their commitment to shaping the […]
On June 8th, the 98th CEIA China Electronic Intelligent Manufacturing Summit Forum was successfully held in Hefei, with HELLER being invited to participate and share their technology. This conference primarily focuses on areas such as smart home appliances, military electronics, and EV automotive electronics, garnering significant attention from industry professionals. The conference was attended by […]
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On June 15th, the 99th CEIA China Electronic Intelligent Manufacturing Summit Forum was successfully held in Huizhou, with HELLER being invited to participate and share their technological expertise. This conference focused on fields such as EV automotive electronics, new display technology, and intelligent digital solutions, attracting a professional audience from surrounding areas including Shenzhen and […]
On June 14, the STEP-BY-STEP TECHNICAL CONFERENCE (SbSTC) was successfully held at the Jinji Lake International Convention Center in Suzhou. HELLER, a professional manufacturer of reflow soldering ovens in the Semicon and SMT industries, was invited to participate in this event. The conference aimed to explore cutting-edge technologies in the industry, bringing together on-site experts, […]