On June 15th, the 99th CEIA China Electronic Intelligent Manufacturing Summit Forum was successfully held in Huizhou, with HELLER being invited to participate and share their technological expertise. This conference focused on fields such as EV automotive electronics, new display technology, and intelligent digital solutions, attracting a professional audience from surrounding areas including Shenzhen and […]
On June 14, the STEP-BY-STEP TECHNICAL CONFERENCE (SbSTC) was successfully held at the Jinji Lake International Convention Center in Suzhou. HELLER, a professional manufacturer of reflow soldering ovens in the Semicon and SMT industries, was invited to participate in this event. The conference aimed to explore cutting-edge technologies in the industry, bringing together on-site experts, […]
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform […]
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise. The conference featured a lineup of over ten exciting topics, […]
With today’s increasing demands on device reliability, vacuum reflow soldering is now seen as the industry’s choice for solder void mitigation. While vacuum reflow soldering works very similar to normal reflow soldering, there are a few key things users should be aware of. An Effective Vacuum Assisted Reflow Process for Void Removal Certain components have […]
April 27, 2023 – The Electronic Manufacturing Technology Committee of Shandong Electronics Society successfully hosted their Annual Conference alongside the 94th CEIA China Electronic Intelligent Manufacturing Summit Forum in Qingdao, Chian. The conference featured discussions on cutting-edge topics such as advanced packaging, smart factories, and smart home appliances. Over 300 professionals from the industry attended […]
The Annual Conference of Henan Electronic Intelligent Manufacturing Industry Alliance and the 92nd CEIA China Electronic Intelligent Manufacturing Summit Forum were successfully held in the Zhengzhou Huawise Hotel. The conferences focused on fields such as instruments, smart factories, 5G communications, and others, which received the attention of many industry insiders. More than 400 industry colleagues […]
February 28th, 2023 Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of convection reflow ovens and pressure curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region. The […]
1826 MK7 Reflow Oven System The 1826 MK7 is a high volume reflow oven system with 8 heated zones and belt speeds up to 1.88m/min. The 1826 MK7 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. The 12” wide heater modules offer profile compatibility with competitor systems. Built-in […]
HCO N2-04 -Inline Curing Oven The Heller curing oven HCO N2-04 offers high productivity with in-line processing for panel applications with a high 4 magazine capacity. Oven Size Including Loaders (mm): 5,670[W] x 2,470[D] x 2,210[H] 4 Magazine Capacity (510x515mm panels) Max Temp: 200C Nitrogen Environment with O2 Levels Down to 100ppm Cleanroom Class 1000 […]